| << return to blog entries
2010-10-28 16:43:57 (5323 views) RF components (the components with the longest lead times by far) are on their way. However it seems that because the manufacturer hasn't figured out packaging yet, the chips will need to be taken out of the reel, baked in a special microchip oven, and then hand placed on the pcbs before reflow soldering, to avoid moisture popping out and making the IC lid explode!
Fortunately we're here on site to assist the PCB assembly house during the initial batch.
Additionally we're 2 weeks away from receiving the EMC report for the DL2K-LINK. Wasn't easy nor quick.
Local weather became very cold almost overnight. The clock is ticking.
Comments
Post new comment
 |
